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Your Ultimate Tech Interview Compass
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System Design
18977
How do the SPI and I2C communication protocols differ from each other?
### Question Analysis The question asks for a comparison between two communication protocols: SPI (S...
Altera, Amazon Web Services, Arm, AT&T, Bosch Rexroth, Celestica, Denso, D-Link, Epson, Foxconn, Hewlett Packard, Hitachi, Jabil, KUKA Robotics, Leidos, Lockheed Martin, Maxim Integrated, Mentor Graphics, Microchip Technology, Mitsubishi Electric, Mitsubishi Electric Automation, Molex, Nuro, NXP Semiconductors, Razer, RS Components, Samsung Electronics, Seagate Technology, Stanley Black & Decker, TE Connectivity, Tektronix, Toyota Boshoku, Vishay Intertechnology, Waymo, Zoox
Embedded Engineer
Technical Knowledge
39600
What's your track record with real time systems, particularly in situations where tasks weren't completed on time?
### Question Analysis This question is asking about your experience and proficiency with real-time s...
Analog Devices, Atlas Copco, Bridgestone, Denso, Ericsson, Foxconn, KLA, Lam Research, Leidos, Lenovo, Magna International, Microchip Technology, Novartis, Razer, Stanley Black & Decker, STMicroelectronics, Teradyne, Toshiba, Ubiquiti, Verizon
Embedded Engineer
System Design
41149
How would you construct an updater mechanism specifically for IoT devices?
### Question Analysis The question is asking you to design a mechanism for updating IoT (Internet o...
Dell Technologies, Denso, Hewlett Packard, Juniper Networks, Kawasaki Robotics, Makita, Meta, Michelin, Microchip Technology, NETGEAR, Peloton, Pirelli, Raytheon, Samsung, Samsung Electronics, Teradyne, TP-Link, Verizon, Vishay Intertechnology, Zoox
Embedded Engineer
System Design
20305
How would you construct an updater mechanism specifically for IoT devices?
### Question Analysis The question is asking how to design an update mechanism specifically tailored...
Dell Technologies, Denso, Hewlett Packard, Juniper Networks, Kawasaki Robotics, Makita, Meta, Michelin, Microchip Technology, NETGEAR, Peloton, Pirelli, Raytheon, Samsung, Samsung Electronics, Teradyne, TP-Link, Verizon, Vishay Intertechnology, Zoox
Embedded Engineer
Coding
14997
In terms of C programming, how are stack and heap memory allocations different?
### Question Analysis This question is asking you to explain the differences between stack and heap ...
Agilent Technologies, Bosch Rexroth, Bose, Cadence Design Systems, Celestica, Denso, Digi-Key Electronics, Flex, Honeywell, KUKA Robotics, Magna International, NXP Semiconductors, Raytheon, Schneider Electric, Siemens, Skyworks Solutions, TDK, Vishay Intertechnology, Xilinx, Zoox
Embedded Engineer
Behavioral
34318
What's the reason behind your decision to look for a job presently?
### Question Analysis This question aims to understand the candidate's motivations for seeking new e...
Agilent Technologies, Apple, Applied Materials, Arm, BAE Systems, Bosch, Bosch Rexroth, Broadcom, Cirrus Logic, Cisco, CRRC, Cypress Semiconductor, Denso, Ericsson, Fujitsu, General Electric, General Motors, Google, Juniper Networks, Lenovo, Magneti Marelli, Maxim Integrated, Meta, Michelin, Mouser Electronics, NetApp, Novartis, NVIDIA, Raytheon, Rohde & Schwarz, Samsung, SpaceX, Taiwan Semiconductor, TDK, Toyota Boshoku, Universal Robots, Xiaomi, Xilinx
Design Verification Engineer, Embedded Engineer
Behavioral
33480
What's the reason behind your decision to look for a job presently?
### Question Analysis This question is a common behavioral interview question that seeks to understa...
Agilent Technologies, Apple, Applied Materials, Arm, BAE Systems, Bosch, Bosch Rexroth, Broadcom, Cirrus Logic, Cisco, CRRC, Cypress Semiconductor, Denso, Ericsson, Fujitsu, General Electric, General Motors, Google, Juniper Networks, Lenovo, Magneti Marelli, Maxim Integrated, Meta, Michelin, Mouser Electronics, NetApp, Novartis, NVIDIA, Raytheon, Rohde & Schwarz, Samsung, SpaceX, Taiwan Semiconductor, TDK, Toyota Boshoku, Universal Robots, Xiaomi, Xilinx
Design Verification Engineer, Embedded Engineer
Technical Knowledge
6816
How do the SPI and I2C communication protocols differ from each other?
### Question Analysis The question is asking for a comparison between two widely used communication ...
Altera, Amazon Web Services, Arm, AT&T, Bosch Rexroth, Celestica, Denso, D-Link, Epson, Foxconn, Hewlett Packard, Hitachi, Jabil, KUKA Robotics, Leidos, Lockheed Martin, Maxim Integrated, Mentor Graphics, Microchip Technology, Mitsubishi Electric, Mitsubishi Electric Automation, Molex, Nuro, NXP Semiconductors, Razer, RS Components, Samsung Electronics, Seagate Technology, Stanley Black & Decker, TE Connectivity, Tektronix, Toyota Boshoku, Vishay Intertechnology, Waymo, Zoox
Embedded Engineer
Behavioral
44675
Describe a time when you had to lend a hand in an area outside your usual tasks. What was the outcome?
### Question Analysis This question is designed to assess your flexibility, willingness to help othe...
Agilent Technologies, Akamai, Amazon Web Services, Apple, ASUS, Atlas Copco, Avnet, Belkin International, Bombardier Transportation, Bose, Canon, Denso, Fanuc, Fujitsu, General Motors, Hitachi, HP, Intel, Jabil, KLA, KUKA Robotics, Kyocera, Lattice Semiconductor, Lear, Legrand, National Instruments, ON Semiconductor, Panasonic, Rohde & Schwarz, Sandvik, Sanmina, Sony, Thales, Vivo, Xilinx, Yamaha Motor Corporation
Design Verification Engineer, Embedded Engineer
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