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II-VI Incorporated
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1955
Can you outline your process for identifying and addressing design flaws?
### Question Analysis This question is asking you to describe your approach to identifying and addre...
Amazon, Cadence Design Systems, Dell, Dialog Semiconductor, D-Link, Goodyear, HARMAN International, II-VI Incorporated, JTEKT, Lam Research, Lenovo, Makita, Micron Technology, Microsoft, Nachi-Fujikoshi, Qorvo, Silicon Labs, SMC, Toyota Boshoku, Western Digital
Embedded Engineer
Technical Knowledge
39797
Can you share your experience with real time systems and your approach when the system couldn't meet real time demands?
### Question Analysis This question is asking about your practical experience with real-time systems...
BAE Systems, Bosch, Bosch Rexroth, Corsair, Cree, Dell Technologies, Hewlett Packard, Honeywell, II-VI Incorporated, LG Display, Logitech, Makita, NVIDIA, Pirelli, Sandvik, Silicon Labs, SpaceX, Universal Robots, Western Digital, Yaskawa Electric
Embedded Engineer
Behavioral
27617
Share an example of when you guided a team.
### Question Analysis This behavioral interview question is designed to assess your leadership skill...
ABB, Agilent Technologies, Akamai, AT&T, Autodesk, Beckman Coulter, Bosch Rexroth, Cadence Design Systems, CRRC, Eaton, Foxconn, GE Aviation, Goodyear, HARMAN International, II-VI Incorporated, Intel, Juul Labs, Lam Research, Lenovo, Lockheed Martin, Molex, NXP Semiconductors, Philips, Rockwell Automation, Schneider Electric, Silicon Labs, SK Hynix, SMC, Sony, TE Connectivity, Tektronix, Toshiba, Verizon, Western Digital, Yokogawa Electric
Design Verification Engineer, Embedded Engineer
Technical Knowledge
14229
Could you elaborate on what constitutes a “real time” system?
### Question Analysis The question asks you to define and elaborate on what is meant by a "real-time...
Altera, AMD, Autodesk, Belkin International, Crestron, Digi-Key Electronics, II-VI Incorporated, JTEKT, Juniper Networks, Kingston Technology, Lear, Leidos, Northrop Grumman, Rockwell Automation, RS Components, Samsung, Sandvik, Silicon Labs, Thales, Zoox
Embedded Engineer
Behavioral
25419
In a past role where you were heavily responsible, how did you successfully handle a tough challenge?
### Question Analysis This question is asking you to provide a real-life example from a past job whe...
Aptiv, Atlas Copco, BAE Systems, BMW Group, Boeing, Bosch, Bosch Rexroth, Cisco, Corsair, D-Link, Fanuc, FLIR Systems, II-VI Incorporated, Infineon, Kingston Technology, Legrand, Magna International, Marvell, MediaTek, Meta, Microchip Technology, Nachi-Fujikoshi, National Instruments, Northrop Grumman, Nuro, ON Semiconductor, Oracle, SMC, Sony, SpaceX, Synopsys, Valeo, Xiaomi, Xilinx
Design Verification Engineer, Embedded Engineer
Behavioral
21227
In a past role where you were heavily responsible, how did you successfully handle a tough challenge?
### Question Analysis This question is a behavioral interview question designed to assess your probl...
Aptiv, Atlas Copco, BAE Systems, BMW Group, Boeing, Bosch, Bosch Rexroth, Cisco, Corsair, D-Link, Fanuc, FLIR Systems, II-VI Incorporated, Infineon, Kingston Technology, Legrand, Magna International, Marvell, MediaTek, Meta, Microchip Technology, Nachi-Fujikoshi, National Instruments, Northrop Grumman, Nuro, ON Semiconductor, Oracle, SMC, Sony, SpaceX, Synopsys, Valeo, Xiaomi, Xilinx
Design Verification Engineer, Embedded Engineer
System Design
1386
What strategies do you recommend for noise reduction in GPIO transitions?
### Question Analysis The question is asking about strategies for reducing noise in General Purpose ...
Agilent Technologies, Aisin Seiki, Amazon, Arista Networks, Boeing, Cree, Digi-Key Electronics, Ericsson, IBM, II-VI Incorporated, National Instruments, Novartis, NXP Semiconductors, OMRON, ON Semiconductor, Oracle, Panasonic, Pirelli, Toshiba, Valeo
Embedded Engineer
Technical Knowledge
2878
In terms of RTOS, how are preemptive and non-preemptive scheduling different?
### Question Analysis This question is asking about the differences between preemptive and non-preem...
AMD, Applied Materials, AT&T, BAE Systems, Bridgestone, Broadcom, Cree, Foxconn, Hewlett Packard, II-VI Incorporated, Juniper Networks, Lenovo, Lumentum, Molex, Mouser Electronics, Nokia, Razer, Renesas Electronics, Sanmina, Toyota Boshoku
Embedded Engineer
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