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Interview QuestionBank

Your Ultimate Tech Interview Compass
Prepare with confidence using our extensive database of real questions from FAANG and beyond.
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System Design
14826
What steps would you take to create an updater mechanism for IoT devices?
### Question Analysis The question focuses on designing an updater mechanism specifically for Intern...
Murata Manufacturing, Autodesk, ABB, Razer, Garmin, Mentor Graphics, Bose, Analog Devices, General Electric, Sony, Maxim Integrated, Texas Instruments, Huawei, Molex, Jabil, Magna International, ZTE, Arrow Electronics, NVIDIA
Embedded Engineer
System Design
51942
What steps would you take to create an updater mechanism for IoT devices?
### Question Analysis The question asks about designing an updater mechanism specifically for IoT (I...
Huawei, Analog Devices, ABB, Magna International, Molex, Mentor Graphics, ZTE, Bose, Maxim Integrated, General Electric, Arrow Electronics, Jabil, Murata Manufacturing, Texas Instruments, Autodesk, Sony, NVIDIA, Garmin, Razer
Embedded Engineer
Behavioral
32065
What was your most innovative contribution in any project?
### Question Analysis This question is asking you to describe a specific instance where you introduc...
Alstom, Altium, Applied Materials, Bosch Rexroth, Canon, Dell Technologies, Embraer, Ericsson, Farnell, Garmin, Hyundai Mobis, Keysight Technologies, Legrand, Maxim Integrated, Meta, Molex, NEC, NetApp, NETGEAR, NXP Semiconductors, ON Semiconductor, Oracle, Renesas Electronics, Rohde & Schwarz, Safran, Samsung Electronics, Seagate Technology, Silicon Motion, Thales, TP-Link, Western Digital
Design Verification Engineer, Embedded Engineer
System Design
18977
How do the SPI and I2C communication protocols differ from each other?
### Question Analysis The question asks for a comparison between two communication protocols: SPI (S...
Altera, Amazon Web Services, Arm, AT&T, Bosch Rexroth, Celestica, Denso, D-Link, Epson, Foxconn, Hewlett Packard, Hitachi, Jabil, KUKA Robotics, Leidos, Lockheed Martin, Maxim Integrated, Mentor Graphics, Microchip Technology, Mitsubishi Electric, Mitsubishi Electric Automation, Molex, Nuro, NXP Semiconductors, Razer, RS Components, Samsung Electronics, Seagate Technology, Stanley Black & Decker, TE Connectivity, Tektronix, Toyota Boshoku, Vishay Intertechnology, Waymo, Zoox
Embedded Engineer
Behavioral
15396
How would you handle a colleague who repeatedly shows up late to meetings?
### Question Analysis This question is assessing your ability to handle interpersonal conflicts and ...
Alstom, Arm, ASML, Atlas Copco, Bombardier, Bosch Rexroth, Continental, Dialog Semiconductor, Digi-Key Electronics, General Electric, Honeywell, JTEKT, Lattice Semiconductor, Leidos, Lenovo, Lockheed Martin, Lumentum, Maxim Integrated, MediaTek, Microsoft, Molex, National Instruments, Novartis, Panasonic, Philips, Qualcomm, RS Components, Sharp, Silicon Labs, SK Hynix, Universal Robots, Varian Medical Systems, Waymo, Xilinx
Design Verification Engineer, Embedded Engineer
Technical Knowledge
25391
In embedded C programming, how do you optimize the use of interrupt priority levels?
### Question Analysis The question asks about optimizing interrupt priority levels in embedded C pro...
ABB, Aisin Seiki, Altium, AMD, Ansys, Arista Networks, AT&T, Aurora, Autodesk, Bang & Olufsen, Benchmark Electronics, Cisco, Comau Robotics, Dell, Dell Technologies, HARMAN International, Hewlett Packard, JTEKT, KLA, KUKA Robotics, Kyocera, LG Electronics, Magna International, Magneti Marelli, Microchip Technology, Microsoft, Molex, NEC, Northrop Grumman, Razer, Sandvik, Synopsys, Teradyne, Thales, ZTE
Embedded Engineer
Behavioral
27617
Share an example of when you guided a team.
### Question Analysis This behavioral interview question is designed to assess your leadership skill...
ABB, Agilent Technologies, Akamai, AT&T, Autodesk, Beckman Coulter, Bosch Rexroth, Cadence Design Systems, CRRC, Eaton, Foxconn, GE Aviation, Goodyear, HARMAN International, II-VI Incorporated, Intel, Juul Labs, Lam Research, Lenovo, Lockheed Martin, Molex, NXP Semiconductors, Philips, Rockwell Automation, Schneider Electric, Silicon Labs, SK Hynix, SMC, Sony, TE Connectivity, Tektronix, Toshiba, Verizon, Western Digital, Yokogawa Electric
Design Verification Engineer, Embedded Engineer
Technical Knowledge
50160
What are the benefits and drawbacks of loops that count up from zero versus those that count down to zero?
### Question Analysis The question is asking you to compare two different approaches to implementing...
Altium, Aurora, Autoliv, Avnet, BAE Systems, Bose, Crestron, Cruise, Epson, Fanuc, General Electric, Hyundai Mobis, Infineon, Kingston Technology, KLA, KUKA Robotics, Lam Research, Lear, Logitech, Michelin, Molex, National Instruments, Nokia, Panasonic, Peloton, Sandvik, Schneider Electric, SMC, TDK, Toyota Boshoku, Universal Robots, Verizon, Western Digital, Xilinx, Zoox
Embedded Engineer
Technical Knowledge
2878
In terms of RTOS, how are preemptive and non-preemptive scheduling different?
### Question Analysis This question is asking about the differences between preemptive and non-preem...
AMD, Applied Materials, AT&T, BAE Systems, Bridgestone, Broadcom, Cree, Foxconn, Hewlett Packard, II-VI Incorporated, Juniper Networks, Lenovo, Lumentum, Molex, Mouser Electronics, Nokia, Razer, Renesas Electronics, Sanmina, Toyota Boshoku
Embedded Engineer
Technical Knowledge
6816
How do the SPI and I2C communication protocols differ from each other?
### Question Analysis The question is asking for a comparison between two widely used communication ...
Altera, Amazon Web Services, Arm, AT&T, Bosch Rexroth, Celestica, Denso, D-Link, Epson, Foxconn, Hewlett Packard, Hitachi, Jabil, KUKA Robotics, Leidos, Lockheed Martin, Maxim Integrated, Mentor Graphics, Microchip Technology, Mitsubishi Electric, Mitsubishi Electric Automation, Molex, Nuro, NXP Semiconductors, Razer, RS Components, Samsung Electronics, Seagate Technology, Stanley Black & Decker, TE Connectivity, Tektronix, Toyota Boshoku, Vishay Intertechnology, Waymo, Zoox
Embedded Engineer
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